FATIMAH, Soja Siti; MORA, Abraham; SUMARNA, Omay; RAMDANIAH, Hudaifatul A. N. Silver Leaching from Printed Circuit Board Using Deep Eutectic Solvent-Oxaline, Maline, and Succiline . al Kimiya: Jurnal Ilmu Kimia dan Terapan, [S. l.], v. 12, n. 1, p. 70–80, 2025. DOI: 10.15575/ak.v12i1.46024. Disponível em: https://journal.uinsgd.ac.id/index.php/ak/article/view/46024. Acesso em: 6 dec. 2025.